Epoxy Adhesive 1E31-G

Epoxy Adhesive 1E31-G

HumiSeal® 1E31-G is:

  • 1 component epoxy-based
  • Electrically conductive
  • Used as a solder replacement

HumiSeal® 1E31-G has:

  • Superior chemical and temperature resistance
  • No VOCs or solvent
  • Excellent adhesion to a variety of substrates

Application of HumiSeal® 1E31-G:

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 1E31-G. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Adhesives can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the adhesive and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 1E31-G is a quick curing, one-part, silver filled epoxy system designed to be used as a solder replacement. This free-flowing liquid can be cured in 2 hours @120ºC. The cured product provides a high amount of flexibility, excellent electrical conductivity, and chemical resistance.


Chemistry Epoxy
Viscosity (CPs) Thixotropic
Pot Life (min)* Heat Cure
Handling Time (min)* N/A
Full Cure** 2 hr @ 120º C
Cure Type Heat Cure
Color Silver
Hardness D80
Operating Temp (°C) -20 to 155 C
Applications Solder Replacement
Substrates Metals, plastics

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