Epoxy Adhesive 2E32-G



Epoxy Adhesive 2E32-G

HumiSeal® 2E32-G is:

  • 2 component epoxy-based
  • Electrically conductive
  • Used as a solder replacement
  • Compliant with NASA’s Outgassing Specification.

HumiSeal® 2E32-G has:

  • Superior chemical and temperature resistance
  • No VOCs or solvent
  • Excellent adhesion to a variety of substrates

Application of HumiSeal® 2E32-G:

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E32-G. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Adhesives can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the adhesives and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E32-G is a two-part, silver filled epoxy system designed to be used as a solder replacement. This free-flowing liquid can be cured at room temperature in 24-48 hours or cured with heat for 1 hour for 100ºC. The cured product provides a high amount of flexibility.

Electrically conductive, silver filled epoxy adhesive paste recommended for bonding and sealing electronic applications which require a combination of good mechanical and electrical properties (3×10-4 Ω*cm). Creates strong, durable, bonds between dissimilar materials.

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Chemistry Epoxy
Viscosity Part A (CPs) 650,000
Viscosity Part B (CPs) 700
Mix Ratio  100:6
Pot Life (min)* 30
Handling Time (min)* 60
Full Cure** 24 hr @ RT or 1 hr @ 10oC
Cure Type 2 component with heat option
Color Silver
Hardness D85
Operating Temp (°C) -60 to 125 C
Applications Solder Replacement
Substrates Metals, plastics

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