Silicone Encapsulation Solutions 2C52

Silicone Encapsulation Solutions 2C52

HumiSeal® 2C52 encapsulant is:

  • Silicone-based
  • Clear
  • 2 components

HumiSeal® 2C52 encapsulant has:

  • No VOCs or solvent
  • Excellent mechanical shock resistance
  • Superior adhesion to a variety of substrates
  • 1-1 mix ratio

Application of HumiSeal® 2C52 encapsulant

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2C52. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Encapsulants can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the encapsulants and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2C52 is a 2 component with a heat-option silicone system designed for easy removal and repair.

Technical or Safety Data Sheet | Free Sample

Chemistry Silicone
Viscosity Part A (CPs) 17,500
Viscosity Part B (CPs) 15,000
Mix Ratio 1:1
Pot Life (min)* 10
Handling Time (min)* 20
Full Cure** 1 hr @ RT or 30 mins @125ºC
Cure Type 2 component with heat option
Color Clear
Hardness <00 0
Operating Temp (°C) -50 to 200º C
Applications Sealing, potting, encapsulations
Substrates Metals, Ceramics, Plastic, Cable, Wire

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