Epoxy Encapsulation Solution 2E10-B

Epoxy Encapsulation Solution 2E10-B

HumiSeal® 2E10-B encapsulant is:

  • Epoxy-based
  • 2 components
  • Medium viscosity
  • Self-leveling

HumiSeal® 2E10-B encapsulant has:

  • High dielectric strength
  • No VOCs or solvent
  • Excellent environmental resistance and moisture resistance
  • Superior adhesion to a variety of substrates

Application of HumiSeal® 2E10-B encapsulant

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E10-B. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Encapsulants can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the encapsulants and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E10-B is an epoxy potting compound with extended work life suitable for electronic applications. The two-part system mixes in an easy 1:1 ratio and cures easily to form a rigid black encapsulant. HumiSeal 2E10-B provides excellent environmental and chemical resistance with a high dielectric strength of 550 V/mil.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) 6,000
Viscosity Part B (CPs) 12,000
Mix Ratio 1:1
Pot Life (min)* 60
Handling Time (min)* 180
Full Cure** 24 hr @ RT or 1 hr @ 65oCo
Cure Type 2 component with heat option
Color Black
Hardness D85
Operating Temp (°C) -50 to 155 C
Applications Industrial sealing, bonding, and encapsulation
Substrates Metals, Glass, Ceramics, Plastics

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