Epoxy Encapsulation Solution 2E11

Epoxy Encapsulation Solution 2E11

HumiSeal® 2E11 encapsulant is:

  • Epoxy-based
  • 2 components
  • Medium viscosity

HumiSeal® 2E11 encapsulant has:

  • No VOCs or solvent
  • Excellent environmental resistance and moisture resistance
  • Superior adhesion to a variety of substrates

Application of HumiSeal® 2E11 encapsulant

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E11. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Encapsulants can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the encapsulants and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs)

10,000 -15,000

Viscosity Part B (CPs) 5,000-7,000
Mix Ratio 1:2
Pot Life (min)* 60
Handling Time (min)* 180
Full Cure** 24 hr @ RT or 1 hr @ 65oC
Cure Type 2 component with heat option
Color Amber
Hardness D40
Operating Temp (°C) -50 to 125 C
Applications Electronic sealing, bonding, and encapsulation
Substrates Metals, Glass, Ceramics, Plastics

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