Epoxy Encapsulation Solution 2E25

HumiSeal® 2E25 encapsulant is:

Epoxy-based
2 components
Medium viscosity

HumiSeal® 2E25 encapsulant has:

Superior chemical and temperature resistance
No VOCs or solvent
Excellent adhesion to a variety of substrates

Application of HumiSeal® 2E25 encapsulant

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E25. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Encapsulants can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials. Users should perform adequate testing to confirm compatibility between the encapsulants and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E25 is an unfilled epoxy resin system useful for adhesive and encapsulant applications. The product can be used at various mix ratios to adjust hardness and bond strength to a variety of materials. HumiSeal 2E25 is a very good electrical insulator and is resistant to gases, water, petroleum products, and acids. FDA compliant in accordance with Title 21. U.S. Code of Federal Regulations, FDA Chapter 1, Subpart B, Sections 175, 105 and 175,300.

*Chemistry*	Epoxy
*Viscosity Part A (CPs)*	12,000
*Viscosity Part B (CPs)*	14,000
*Mix Ratio*	2:1 to 1:2
Pot Life (min)*	60
Handling Time (min)*	120
Full Cure**	12 hr @ RT or 2 hr @ 65oC
*Cure Type*	2 component with heat option
*Color*	Amber
*Hardness*	D64 to D80 depending on mix ratio
*Operating Temp (°C)*	-40 to 155 C
*Applications*	Multiple
*Substrates*	Metals, Glass, Ceramics, Plastics