Epoxy Encapsulation Solution 2E42T-B

Epoxy Encapsulation Solution 2E42T-B

HumiSeal® 2E42T-B encapsulant is:

  • Thermally conductive (0.83 W/mK)
  • Epoxy-based
  • 2 components
  • Medium viscosity
  • Mixed at a simple 1:1 ratio

HumiSeal® 2E42T-B encapsulant has:

  • No VOCs or solvent
  • Excellent mechanical shock and chemical resistance
  • Superior adhesion to a variety of substrates

Application of HumiSeal® 2E42T-B encapsulant

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E42T-B. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Encapsulants can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the encapsulants and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E42T-B is a room temperature curing two-part epoxy system designed to be used to encapsulate electronic packages. This product has been formulated to provide the user with an easy to work with one to one by volume mix ratio. Once encapsulated with HumiSeal® 2E42T-B an electronic package will exhibit a higher resistance to both physical shocks as well as exposure to water and other potentially harmful chemicals.

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Chemistry Epoxy
Viscosity Part A (CPs) 20,000
Viscosity Part B (CPs) 24,000
Mix Ratio 1:1
Pot Life (min)* 60
Handling Time (min)* 180
Full Cure** 24 hr @ RT or 2 hr @ 65 ºC
Cure Type Epoxy
Color Black
Hardness D65
Operating Temp (°C) -50 to 155 C
Applications Electronic and Industrial encapsulation
Substrates Metals, Glass, Ceramics, Plastic

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