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  • HumiSeal

    HUM 2E11

    HUM 2E11
    HumiSeal

    HUM 2E11

    HUM 2E11

    HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

    Overview

    HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

    View SpecificationsFind SDSRequest SampleDownload TDS

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    • Overview / Specs
    • Downloads
    • Related products

    HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

    Overview

    HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

    Specifications

    ChemistryEpoxy
    Curing ConditionsAir
    Material24 hours @ room temp
    Cure Time24 hours @ room temp
    Recommended Thickness25-75 microns
    Specific GravityPart A:1.16 /Part B: 1.00

    Downloads

    • HUM 2E11 Technical Data Sheet

      PDFDownload

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