THERMOSINK 35-3 has been formulated to meet the demands of various industries, particularly in environments where efficient thermal conductivity is vital. The rapid curing at room temperature ensures minimal production downtime, making it an ideal choice for manufacturers looking to enhance their operational efficiency.

Key Features

• Two-component system: Simple mixing process enhances user convenience.
• Low viscosity: Facilitates easy application and ensures uniform coverage.
• Rapid room temperature cure: Reduces lead times in manufacturing processes.
• High thermal conductivity: Ensures efficient heat transfer for optimal device performance.
• Versatile applications: Suitable for various electrical and thermal interface needs.

Applications

• Electrical potting for circuit protection.
• Thermal interface for heat sinks and electronic components.
• Sealing and bonding in medical devices.
• Connector sealing to guard against environmental factors.
• EMI shielding for sensitive electronic systems.

Benefits

• Enhances product reliability by improving heat dissipation.
• Increases the lifespan of electronic devices through effective thermal management.
• Provides excellent adhesion to multiple substrates, including metal, glass, and plastic.
• Compliant with RoHS and REACH regulations, ensuring safety in applications.
• Fully ISO-9001 certified manufacturing processes ensure consistent quality.