HumiSeal® 2C51 is a two-component high strength, fast curing silicone encapsulating gel supplied as Parts A and B, suitable for general printed circuit board applications. HumiSeal® 2C51 is characterized by room temperature cure and low viscosity for ease of application and contains UV tracer for ease of inspection. The two components of HumiSeal 2C51 are blue and yellow and turn green when mixed. HumiSeal® 2C51 is RoHS Directive EU 2015/863 compliant.
HumiSeal® 2C51 is a two-component high strength, fast curing silicone encapsulating gel supplied as Parts A and B, suitable for general printed circuit board applications. HumiSeal® 2C51 is characterized by room temperature cure and low viscosity for ease of application and contains UV tracer for ease of inspection. The two components of HumiSeal 2C51 are blue and yellow and turn green when mixed. HumiSeal® 2C51 is RoHS Directive EU 2015/863 compliant.
Have a Question and Need to Speak to an Expert?
Our experts are ready to answer your questions!
Contact Us| Chemistry | Silicone |
|---|---|
| Curing Conditions | Air, Heat |
| Material | 30 minutes @ 70°C or 60 min @ RT |
| Cure Time | 30 minutes @ 70°C or 60 min @ RT |
| Volatile Organic Compounds | 0 g/l |
HUM 2C51 Technical Data Sheet
PDFDownloadHumiSeal RoHS Certificate Acrylic Conformal Coatings
PDFDownloadHumiSeal REACH Statement
PDFDownload
HumiSeal® 1B51NS is a fast drying, single component, synthetic rubber conformal coating that contains methylcyclohexane solvent that is more environmentally friendly than traditional solvents.

HumiSeal® 1A33 Gel is a single component thixotropic polyurethane paste, suitable for general printed circuit board applications.

HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications.

HumiSeal® 1C51 is a single component, VOC-free, fast thermal curing silicone conformal coating.

HumiSeal® 1B51LU is a fast drying, single component, synthetic rubber conformal coating that provides excellent moisture and environmental protection for printed circuit assemblies.
