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A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages. This two to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once bonded with this product, an electronic package and/or bonded surface will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages. This two to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once bonded with this product, an electronic package and/or bonded surface will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
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This two-part, green epoxy adhesive cures at room temperature for non-sag structural bonding. It offers low shrinkage, strong shock resistance, reliable mechanical and electrical properties, and performs well on damp surfaces.
A medium viscosity epoxy resin system designed for industrial adhesion, small potting, and laminating applications where a fast process cure is required.
This product was developed to mix, apply, and cure underwater. This product is a very versatile adhesive that will work on most applications.
A two component, 100% solids, high-temperature epoxy with a maximum service temperature of 300°F (149°C). It can be used as a standalone pipeline coating or as a primer for Tapecoat High-Temperature Tapes.
A two-part, 100% solids, Zero VOC, below grade, fast curing epoxy with a maximum service temperature is 300°F (149°C), and can be backfilled in 2-3 hours at 70°F and 50% relative humidity.