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HumiSeal

HUM 2E11

HUM 2E11
HumiSeal

HUM 2E11

HUM 2E11

HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

Overview

HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

View SpecificationsFind SDSRequest SampleDownload TDS

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  • Overview / Specs
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  • Related products

HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

Overview

HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.

Specifications

ChemistryEpoxy
Curing ConditionsAir
Material24 hours @ room temp
Cure Time24 hours @ room temp
Recommended Thickness25-75 microns
Specific GravityPart A:1.16 /Part B: 1.00

Downloads

  • HUM 2E11 Technical Data Sheet

    PDFDownload

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