Epoxy Adhesive 2E33-G

Epoxy Adhesive 2E33-G

HumiSeal® 2E33-G is:

  • 2 component epoxy-based
  • Electrically conductive
  • Used as a solder replacement

HumiSeal® 2E33-G has:

  • Superior chemical and temperature resistance
  • No VOCs or solvent
  • Excellent adhesion to a variety of substrates

Application of HumiSeal® 2E33-G:

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E33-G. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Adhesives can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the adhesives and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E33-G is long work life, two-part, silver filled epoxy system designed to be used as a solder replacement. This free-flowing liquid can be cured at room temperature in 24-48 hours. The cured product provides a high amount of flexibility, excellent electrical conductivity, and chemical resistance.


Chemistry Epoxy
Viscosity Part A (CPs) Thixotropic
Viscosity Part B (CPs) Thixotropic
Mix Ratio 1:1
Pot Life (min)* 100
Handling Time (min)* 180
Full Cure** 24 hr @ RT or 1 hr @ 110º C
Cure Type 2 component with heat option
Color Silver
Hardness D40
Operating Temp (°C) -50 to 155 C
Applications Solder Replacement
Substrates Metals, plastics

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