PCB Protective Advanced Adhesives & Encapsulants

Adhesives and Encapsulants

Chase Corporation offers a focused portfolio of epoxies, adhesives and encapsulants engineered for strong bonding, electrical insulation, environmental protection, and long-term reliability. From 4EvaWeld™ and 4EvaFill™ epoxy putty sticks for fast, dependable repairs to advanced adhesive systems for industrial assembly, our solutions help simplify application while delivering durable performance.
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For electronics protection, ThermoSink thermally conductive encapsulants provide effective thermal management while shielding sensitive components from moisture, mechanical stress, and harsh operating conditions. Together, these repair, bonding, and encapsulation technologies support demanding applications across electronics, manufacturing, maintenance, and industrial environments.

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Introducing 4EvaFillTM and 4EvaWeldTM – The Ultimate Repair Solutions

Epoxy Putty for Plastic and Metal

Epoxy Putty for Wood

Discover the perfect repair solution with 4EvaWeld™ Putty Sticks, available in three versatile versions to tackle any project. Whether you need the quick-setting convenience of 4EvaWeld™, the extended working time of 4EvaWeld™ Slow Cure, or the heavy-duty strength of 4EvaWeld™ UltraMax, each formula is designed for easy, mess-free use. Simply mix by hand to create a durable bond on metals, plastics, composites, and more. With features like oil resistance, wet and dry application, and the ability to sand, drill, tap, and paint after curing, 4EvaWeld™ makes repairs and restorations effortless. Click to learn more about which version is right for your next project!
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ThermoSink: Advanced Thermal Encapsulation for Electronics Protection

ThermoSink thermally conductive polymers provide efficient heat dissipation while encapsulating and protecting sensitive electronics. Designed for high-performance PCB applications, ThermoSink formulations balance thermal conductivity, flow properties, and durability to ensure long-lasting reliability. With options across epoxy, silicone, and urethane chemistries, ThermoSink materials allow engineers to optimize temperature resistance, hardness, and flexibility for their specific needs.

The right encapsulant protects electronics from extreme operating conditions, including thermal, mechanical and electrical stress. Heat, especially, is one of the top reasons electronics fail.

The ThermoSink family covers a wide range of performance characteristics. Choosing the right coating should consider PCB surface energy, exothermic release during cure, desired chemistry, and material hardness.

ThermoSink 35-7 offers superior flow, self-leveling, bubble dispersion, and high-speed curing.

Benefits of PCB Encapsulation

Moisture and Corrosion Resistance

Protects electronics from environmental damage caused by water and corrosive elements.

Shock and Vibration Absorption

Minimizes physical stress to components in demanding operating conditions.

Electrical Insulation Stability

Prevents short circuits and maintains consistent electrical performance.

Low Shrinkage Properties

Ensures encapsulants do not damage delicate components during curing.

Long-Term Structural Durability

Provides lasting protection and reliability for electronic assemblies.

Application Versatility

Suitable for full potting, targeted encapsulation, or selective coating needs.

an electronic circuit board with water on it

Reliable Protection Coverage for PCB Assemblies

Chase Corporation’s HumiSeal and Resin Designs encapsulants deliver advanced protection for PCBs and sensitive components. By resisting moisture and corrosion, absorbing mechanical shock, and ensuring electrical insulation, they safeguard electronics for consistent performance in harsh conditions. Their low shrinkage and durable design maintain structural integrity while reducing stress on delicate components. Choose solutions that provide precision and confidence for professional applications.
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Adhesive Solutions for Precision Bonding

Chase Corporation’s UV and epoxy adhesives offer distinct benefits tailored to specific applications. UV adhesives cure rapidly under ultraviolet light, ensuring efficiency for glass, optical bonding, and electronics assembly. Epoxy adhesives deliver exceptional strength, chemical resistance, and long-term durability, making them ideal for structural bonding and encapsulation. Each option provides reliable performance and application flexibility to meet diverse industrial needs.
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Adhesive Options for Simplified Application and Strength

Chase Corporation offers one-component and two-component adhesives tailored to diverse industrial needs. One-component adhesives simplify application with pre-mixed formulations that cure efficiently using heat, moisture, or UV exposure, making them ideal for automated processes. Two-component adhesives, mixed at the point of use, deliver exceptional bonding strength, chemical resistance, and durability, ensuring reliability for demanding structural applications. Explore advanced adhesive solutions designed to maximize efficiency and performance.
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Curable Adhesives vs. Film Adhesives: Choosing the Right Bonding Solution

Adhesives play a critical role in product assembly, providing strength, durability, and environmental resistance. Depending on application needs, manufacturers can choose between curable adhesives, which require UV, heat, or moisture to solidify, and film adhesives, which offer pre-formed bonding without curing.

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Curable Adhesives

Liquid adhesives that harden through curing, offering strong bonds and excellent environmental resistance for various substrates.

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Film Adhesives

Pre-formed adhesives that provide precise, uniform bonding with no curing required, ensuring clean and efficient application.

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Superior Optical Clarity with Liquid Optically Clear Adhesives (LOCA)

Liquid Optically Clear Adhesives (LOCA) play a critical role in LCD and touchscreen assembly, ensuring exceptional optical clarity, durability, and long-term performance. Poorly designed adhesives can lead to haze, light refraction, and clarity issues, reducing display quality over time. HumiSeal’s advanced LOCA formulations eliminate these risks with precise chemical balance, unmatched adhesion, and compatibility with edge-sealing materials, ensuring crystal-clear displays that stand the test of time.

Features and Benefits

Exceptional Clarity

Efficient Processing

Strong & Flexible Bonding

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Chase Corporation offers a focused portfolio of epoxies, adhesives and encapsulants engineered for strong bonding, electrical insulation, environmental protection, and long-term reliability. From 4EvaWeld™ and 4EvaFill™ epoxy putty sticks for fast, dependable repairs to advanced adhesive systems for industrial assembly, our solutions help simplify application while delivering durable performance.
﻿
For electronics protection, ThermoSink thermally conductive encapsulants provide effective thermal management while shielding sensitive components from moisture, mechanical stress, and harsh operating conditions. Together, these repair, bonding, and encapsulation technologies support demanding applications across electronics, manufacturing, maintenance, and industrial environments.

Adhesives and Encapsulants

Additional Resources:

Introducing 4EvaFill^TM and 4EvaWeld^TM – The Ultimate Repair Solutions

Reliable Protection Coverage for PCB Assemblies

Adhesive Solutions for Precision Bonding

Adhesive Options for Simplified Application and Strength

Expert Insights

Memberships & Certifications

Additional Resources:

Adhesive Solutions for Precision Bonding

Adhesive Options for Simplified Application and Strength

Memberships & Certifications

Adhesives and Encapsulants

Additional Resources:

Introducing 4EvaFillTM and 4EvaWeldTM – The Ultimate Repair Solutions

Reliable Protection Coverage for PCB Assemblies

Adhesive Solutions for Precision Bonding

Adhesive Options for Simplified Application and Strength

Expert Insights

Memberships & Certifications

Additional Resources:

Adhesive Solutions for Precision Bonding

Adhesive Options for Simplified Application and Strength

Memberships & Certifications

Contact Us

Introducing 4EvaFill^TM and 4EvaWeld^TM – The Ultimate Repair Solutions