Adhesives and EncapsulantsAdhesives and Encapsulants
ThermoSink: Advanced Thermal Encapsulation for Electronics Protection
ThermoSink thermally conductive polymers provide efficient heat dissipation while encapsulating and protecting sensitive electronics. Designed for high-performance PCB applications, ThermoSink formulations balance thermal conductivity, flow properties, and durability to ensure long-lasting reliability. With options across epoxy, silicone, and urethane chemistries, ThermoSink materials allow engineers to optimize temperature resistance, hardness, and flexibility for their specific needs.
The right encapsulant protects electronics from extreme operating conditions, including thermal, mechanical and electrical stress. Heat, especially, is one of the top reasons electronics fail.
The ThermoSink family covers a wide range of performance characteristics. Choosing the right coating should consider PCB surface energy, exothermic release during cure, desired chemistry, and material hardness.
ThermoSink 35-7 offers superior flow, self-leveling, bubble dispersion, and high-speed curing.
