T2723F: THERMALLY CONDUCTIVE & ELECTRICALLY INSULATIVE FILM

Product Description

TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coeeficient of thermal expansion, moderately high glass transition temperature, and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C.

Applications: 

•  Electronic board assembly

Features

• Chemical, heat, moisture resistant
• B-staged film•
• Electrically insulative
• B-staged film
• Low coefficient of thermal expansion

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