Resin Designs TP-2101 Thermal Gap Pad is a cost-competitive, highly compressible, silicone gap filler with moderate bulk conductivity. This filler uses foam reinforcement to maintain compressibility, while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large airgap.

Key Features

• Thermal conductivity: 0.73 W/ m•K•
• Both Sides Compressible
• Foam reinforced
• Flame Retardant
• Alumina-Filled System

Applications

• Switching devices
• Automatic power boards
• Microinverters

Typical Properties: 

Storage:

Because these are precured materials, there is no special storage condition or usage date required. The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.