The Chase Corporation

Tapecoat Moldable Sealant

54002

A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.

Overview

A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Tapecoat Moldable Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.

$485.00/CASE – Quantity per Package: 12 Rolls

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A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.

Overview

A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Tapecoat Moldable Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.

Specifications

Quantity per Package12 Rolls
PackagingCASE

Downloads

  • Tapecoat Moldable Sealant Technical Data Sheet

    pdfDownload

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