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The Chase Corporation

Royston Butyl Moldable Sealant

53017
The Chase Corporation

Royston Butyl Moldable Sealant

53017

A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates.

Overview

A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates. It requires the use of Roybond 747 Primer before application.

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  • Overview / Specs
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  • Related products

A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates.

Overview

A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates. It requires the use of Roybond 747 Primer before application.

Downloads

  • Royston Butyl Moldable Sealant Technical Data Sheet

    PDFDownload

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