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A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.
A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Tapecoat Moldable Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.
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| Packaging | ROLL |
|---|---|
| Shipping Weight (lbs) | 3.5 |
| Quantity per Package | 1 Roll |
Tapecoat Moldable Sealant Technical Data Sheet
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A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces.
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