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Resin Designs

HP 115-158 BLACK

71166
Resin Designs

HP 115-158 BLACK

71166

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A two-component system recommended for bonding applications where high shock impact resistance and peel resistance are desired. It develops strong bonds to a wide range of materials, including plastics, metals, ceramics, and glass. Once fully cured, this product offers high mechanical, electrical, and thermal shock resistance, as well as low permeability to gases and vapors. It, also, offers high dimensional stability over a wide temperature range.

Overview

A two-component system recommended for bonding applications where high shock impact resistance and peel resistance are desired. It develops strong bonds to a wide range of materials, including plastics, metals, ceramics, and glass. Once fully cured, this product offers high mechanical, electrical, and thermal shock resistance, as well as low permeability to gases and vapors. It, also, offers high dimensional stability over a wide temperature range.

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A two-component system recommended for bonding applications where high shock impact resistance and peel resistance are desired. It develops strong bonds to a wide range of materials, including plastics, metals, ceramics, and glass. Once fully cured, this product offers high mechanical, electrical, and thermal shock resistance, as well as low permeability to gases and vapors. It, also, offers high dimensional stability over a wide temperature range.

Overview

A two-component system recommended for bonding applications where high shock impact resistance and peel resistance are desired. It develops strong bonds to a wide range of materials, including plastics, metals, ceramics, and glass. Once fully cured, this product offers high mechanical, electrical, and thermal shock resistance, as well as low permeability to gases and vapors. It, also, offers high dimensional stability over a wide temperature range.

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