HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.
Overview
HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.
HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.
Overview
HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications. This product has been formulated with an easy 1:2 volume mix-ratio. HumiSeal 2E11 provides superior adhesion to a wide variety of substrates including most metals and plastics.
Specifications
| Chemistry | Epoxy |
|---|---|
| Curing Conditions | Air |
| Material | 24 hours @ room temp |
| Cure Time | 24 hours @ room temp |
| Recommended Thickness | 25-75 microns |
| Specific Gravity | Part A:1.16 /Part B: 1.00 |
Downloads
HUM 2E11 Technical Data Sheet
PDFDownload
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