Encapsulation Solutions

Encapsulation Solutions

Encapsulation Solutions

Encapsulating liquids are used to protect devices from extreme operating conditions, mechanical stresses, and electrical shock. HumiSeal potting compounds are formulated from epoxy, urethane or acrylated urethanes. They are engineered with a variety of cure mechanisms to fit all your automotive, aerospace, industrial, or consumer application requirements. Our commitment to your needs goes beyond the standard product portfolio, as we will custom formulate a product to fit your exact needs.

Encapsulants Hardness / Viscosity Reference Chart

Encapsulant Hardness : Viscosity Reference Chart

HumiSeal Encapsulants Adhesives Matrix

EncapsulantsViscosity Part A (CPs)Viscosity Part B (CPs)Full Cure**Cure TypeHardness
2E11

Formulated to work with 1:2 volume mix-ratio, this potting material provides superior adhesion to variety of substrates.
Medium viscosity with long work life.
12,0006,00024 hr @ RT or
1 hr @ 65oC
2 component with heat optionD40
2E16

Transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium sized
electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties,
ideal for protection against harsh environments.
1,0009048 hr @ RT2 componentA55
2E25Epoxy adhesive or encapsulant with range of mix ratios and hardness resulting in high bond strength to variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant.12,00014,00012 hr @ RT or
2 hrs @ 65oC
2 component with heat optionD64 to D80
2A13Low stress elastic encapsulant with low viscosity and simple 1:1 mix ratio. Protection to the electronic package when exposed to multiple thermal shocks and high vibration.12,0007,00024 hr @ RT or
1 hr @ 65oC
2 component with heat optionA30
2A14-UHigh performance potting and encapsulation applications with 1:2 mix ratio. This fast setting potting material and encapsulant cures to a tough, moisture resistant and flexible polymer. Good for multiple thermal cycle requirements or high mechanical shock applications.2,0002,50024 hr @ RT 2 component with heat optionA90
2A15-BTwo part 1:2 mix ratio, polyurethane system designed to be used for high performance potting and encapsulation applications. Tough flexible polymer for the protection of electronics when exposed to multiple thermal shocks and high vibration.1,00012,00024 hr @ RT
2 component with heat optionA90
2A16

Room temperature curing, two part polyurethane system designed to be used for high performance potting and
encapsulation applications. This two to one mix ratio product cures at room temperature to a tough flexible polymer.
17,0008,0007 days @ RT or
2hr @ 65°C
2 component
with heat option
A50
2C51

Two component high strength, fast curing silicone suitable for general sealing and encapsulating. Low viscosity 1:1 mix
ratio with fast room temperature cure for ease of application.
2755501 hr @ RT or
30 min @ 70oC
2 component
with heat option
00-45
2C52

Fast curing, two part silicone for applications requiring a soft, high surface tack sealant. Simple 1:1 mixture with limited
flow-ability after dispensing. Adheres and seals most surfaces but can be easily removed and repaired after curing.
17,50015,0001 hr @ RT or
2 min @ 125oC
2 component
with heat option
<00 0
UV14

Fast Curing urethane acrylate system for adhesion to difficult to bond plastics. In addition to the UV cure this material
has a secondary moisture cure mechanism to ensure cure in areas shadowed in UV light. This product also has
excellent resistance to moisture and maintains flexibility at low temperatures.
22,000-24 hr @ RTUV/moistureD50
2UV10

Two component UV gellable urethane with 1:2 mix ratio. Tack free surface and functional strength is achieved with UV
exposure. The secondary reaction ensures shadowed areas are completely polymerized. High elongation and bond
strength ensures protection of electronics against thermal shock and mechanical stresses.
100,00060,00024 hr @ RTUV-gelable
w/ 2 component
D39

HumiSeal Encapsulants Thermally Conductive

EncapsulantsViscosity Part A (CPs)Viscosity Part B (CPs)Full Cure**Cure TypeHardness
2E41T-B

Two part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix
ration with medium-high viscosity. Excellent dielectric strength (500V/mil).
20,00024,00024 hr @ RT or
2 hr @ 65oC
2 component with heat optionD60
2E42T-B

Two part, thermally conductive (0.83 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix
ration with medium-high viscosity. Excellent dielectric strength (500V/mil).
35,00030,00024 hr @ RT or
2 hr @ 65oC
2 component
with heat option
D65
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