Encapsulation Solutions

Encapsulation Solutions

Encapsulating liquids are used to protect devices from extreme operating conditions, mechanical stresses, and electrical shock. HumiSeal potting compounds are formulated from epoxy, urethane or acrylated urethanes. They are engineered with a variety of cure mechanisms to fit all your automotive, aerospace, industrial, or consumer application requirements. Our commitment to your needs goes beyond the standard product portfolio, as we will custom formulate a product to fit your exact needs.

Encapsulants Hardness / Viscosity Reference Chart

Encapsulant Hardness : Viscosity Reference Chart

Encapsulation SolutionsHumiSeal® 2E11

2 component epoxies formulated to work with one to two volume mix-ratio, this potting material provides superior adhesion to a variety of substrates. Medium viscosity with long work life. Hardness D40.

  • Chemistry: Epoxy
  • Pot life (min):60
  • Substrates: Metals, Glass, Ceramics, Plastics

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Encapsulation SolutionsHumiSeal® 2E10-B

Easily mixed at 1:1 ratio. Industrial or electronic epoxy potting compound with extended work life. Provides excellent environmental and chemical resistance with a high dielectric strength of 550V/mil. Hardness D85.

  • Chemistry: Epoxy
  • Pot life (min):60
  • Substrates: Metals, Glass, Ceramics, Plastics

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Encapsulation SolutionsHumiSeal® 2E25

Epoxy adhesive or encapsulant with a range of mix ratios and hardness resulting in high bond strength to a variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant

  • Chemistry: Epoxy
  • Pot life (min):60
  • Substrates:Metals, Glass, Ceramics, Plastics

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Encapsulation SolutionsHumiSeal® 2E27

Two-part epoxy encapsulates specifically designed for PCB component protection.

  • Chemistry: Epoxy
  • Pot life (min):15
  • Substrates: Metals, Wood, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2E41T-B

Two-part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with med-high viscosity. Excellent dielectric strength (500V/mil).

  • Chemistry: Epoxy
  • Pot life (min):60
  • Substrates:Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2E42T-B

Two-part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with med-high viscosity. Excellent dielectric strength (500V/mil).

  • Chemistry: Epoxy
  • Pot life (min):60
  • Substrates:Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2A10

Non-yellowing, UV stable, two-part structural adhesive and potting urethane, formulated for LED, photovoltaic, and capacitor sealing. Low viscosity with simple 2:1 mix ratio and water-white clear after full cure.

  • Chemistry: Urethane
  • Pot life (min):3
  • Substrates:Metals, Wood, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2A11

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use in wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock

  • Chemistry: Urethane
  • Pot life (min):7
  • Substrates:Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2A13

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use in wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock.

  • Chemistry: Urethane
  • Pot life (min):60
  • Substrates:Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2A14-U

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use of wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock

  • Chemistry: Urethane
  • Pot life (min):6
  • Substrates:Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2A15-B

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use in wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock.

  • Chemistry: Urethane
  • Pot life (min):12
  • Substrates:Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2UV10

One part, high-shear thinning and high viscosity, outstanding wetting properties, designed for high mechanical shock protection and exceptional adhesion to a variety of materials. Will cure rapidly with exposure to UV-light and develop high adhesion properties with ambient secondary moisture cure.

  • Chemistry: Urethane Acrylate
  • Pot life (min): When exposed to UV or 7 min in shadow areas
  • Substrates:Potting, Encapsulation

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Encapsulation SolutionsHumiSeal® 2UV11

Two-part with medium viscosity, UV gelable urethane potting system designed for high-end electronic protection. This soft encapsulant will protect components from high impact and vibration in high humidity operating conditions.

  • Chemistry: Urethane Acrylate
  • Pot life (min): When exposed to UV or 7 min in shadow areas

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Encapsulation SolutionsHumiSeal® UV12

One-part, low viscosity and fast curing with exposure to UV light. When cured it is a water white clear, non-yellowing, rigid encapsulant for LED and other optical applications.

  • Chemistry: Urethane Acrylate
  • Pot life (min): Until exposed to UV
  • Substrates:LED encapsulation; light arrays

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Encapsulation SolutionsHumiSeal® UV13-W

One part with medium viscosity encapsulant. Cures with UV light exposure and has a secondary moisture cure for shadow areas. Provides excellent protection against moisture and high mechanical stresses. Designed for high throughput environments.

  • Chemistry: Urethane Acrylate
  • Pot life (min): Until exposed to UV
  • Substrates: Metals, Glass, Ceramics, Plastic

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Encapsulation SolutionsHumiSeal® 2C51

Two-component, high-strength, fast curing silicone suitable for general sealing and encapsulating. Simple 1-to-1 mix ratio. Adheres and seals most surfaces and easily removed and repaired.

  • Chemistry: Silicone
  • Pot life (min): 10 minutes
  • Substrates: Metals, Ceramics, Plastic, Cable, Wire

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Encapsulation SolutionsHumiSeal® 2C52

Two-component, fast curing, soft, high-surface tack silicone suitable for general sealing and encapsulating. Simple 1-to-1 mix ratio. Adheres and seals most surfaces and easily removed and repaired.

  • Chemistry: Silicone
  • Pot life (min): 10 minutes
  • Substrates: Metals, Ceramics, Plastic, Cable, Wire

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