Adhesives Epoxy Encapsulants

Epoxy Encapsulants

Encapsulating liquids are used to protect devices from extreme operating conditions, mechanical stresses, and electrical shock. Resin Designs potting compounds are formulated from epoxy, urethane or acrylated urethanes. They are engineered with a variety of cure mechanisms to fit all your automotive, aerospace, industrial, or consumer application requirements. Our commitment to your needs goes beyond the standard product portfolio, as we will custom formulate a product to fit your exact needs.

[table id=15 /]

*The information contained here is provided for product selection purposes only and is not intended to be considered specification or performance data. Under no circumstances will the seller be liable for any loss, damage, expense, or incidental or consequential damage of any kind arising in connection with the use or inability to use its product. Specific conditions of sale and Chase’s limited warranty are set out in detail in Chase corporation terms and conditions of sale. Those terms and conditions are the only sources that contain Chase’s limited warranty and other terms and conditions.

Quick Links

Testing Viscosity of Epoxy Encapsulant

Epoxy Encapsulation poured into a PCB