Epoxy Encapsulants

Adhesives Epoxy Encapsulants

Epoxy Encapsulants

Encapsulating liquids are used to protect devices from extreme operating conditions, mechanical stresses, and electrical shock. Resin Designs potting compounds are formulated from epoxy, urethane or acrylated urethanes. They are engineered with a variety of cure mechanisms to fit all your automotive, aerospace, industrial, or consumer application requirements. Our commitment to your needs goes beyond the standard product portfolio, as we will custom formulate a product to fit your exact needs.

Product
Type
Color
DescriptionViscosityHardnessElongationOperating TemperatureNotes
Axis 84211
2 Part Epoxy
Clear

General purpose epoxy. Excellent electrical insulator with resistance to many chemicals and vapors.
12,000

D72

10%

-40 to 155 C

FDA direct and indirect food contact compliant. Multiple mix ratio options.
Epoxy 020608 WES2 Part Epoxy
Amber
Thermally conductive. Long open time. Bond, seal, and repair polyamide based epoxy.
9,000
D40
90%
-50 to 125 C
60 minute open time, excellent dielectric strength, good for electronics bonding and sealing.
Epoxy 021906-1T2 Part Epoxy
Black
Thermally conductive. General purpose epoxy encapsulant for improved resistance to mechanical shock, chemicals, and vapors.
30,000
D60
90%
-50 to 155 C
Simple 1:1 mix ratio, room temperature cure, 60 minute work life.
Epoxy 040208-22 Part Epoxy
Light Tan
Thermally conductive, electrically insulating, fire retardant epoxy encapsulant.
22,000
D65
80%
-50 to 155 C
Simple 1:1 mix ratio, room temperature cure, 60 minute work life.
Epoxy 042304-102 Part Epoxy
Amber
Short open time, low viscosity general purpose encapsulant for smaller electronics protection, superior water and moisture vapor protection.
5,000
D60
50%
-60 to 135 C
Simple 1:1 mix ratio, room temperature cure, 15 minute work life.
Hybrid Polymer 113-1072 Part Epoxy
Black
Extended work life, flowable self leveling, hard durometer black encapsulant.
12,000
D85
8%
-50 to 155 C
Simple 1:1 mix ratio, room temperature cure, 60 minute work life.
Polymer 131-77MX
2 Part Epoxy
ClearModerate work life (30 minutes) clear epoxy encapsulant for electronics. Excellent resistance to water and water vapor, many chemicals, excellent bonds to polycarbonate and nylon.
4,700D3590%-60 to 135 CSofter and flexible with low shrinkage, 2:1 mix ratio, potting RF transmitters and electronics.

*The information contained here is provided for product selection purposes only and is not intended to be considered specification or performance data. Under no circumstances will the seller be liable for any loss, damage, expense, or incidental or consequential damage of any kind arising in connection with the use or inability to use its product. Specific conditions of sale and Chase’s limited warranty are set out in detail in Chase corporation terms and conditions of sale. Those terms and conditions are the only sources that contain Chase’s limited warranty and other terms and conditions.

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Epoxy Encapsulation poured into a PCB

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