Epoxy Encapsulants -040208-2
EPOXY 040208-2: HIGH THERMAL K EPOXY ENCAPSULANT
Epoxy 040208-2 is a room temperature curing, two part epoxy system designed to be used to encapsulate electronic packages.This product has been formulated so as to provide the user with an easy to work with one to one by volume mix-ratio. Once encapsulated with the Epoxy 040208-2, an electronic package will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
- Electronic encapsulation
- Two part convenient mix ratio
- Room temperature cure
- Moisture and chemically resistant
- Electrically insulating