Epoxy Encapsulants – 042304-10
EPOXY 042304-10: UNFILLED EPOXY BASED ENCAPSULATION POLYMER
Epoxy 042304-10 is a room temperature curing, two part epoxy system designed to be used to encapsulate small electronic packages. This one to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once encapsulated with the Epoxy 042304-10 an electronic package will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
- Electronic encapsulation
- Room temperature cure
- Moisture and chemically resistant
- Physical shock resistant