EPOXY HYBRID POLYMER: LOW STRESS, UNFILLED EPOXY BASED ENCAPSULATION POLYMER

Product Description

Hybrid Polymer 131-77MX is a transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium-sized electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments. Hybrid Polymer 131-77MX also bonds readily to polycarbonate, nylon, and metal, making it a supreme choice for electronics encapsulation

Applications: 

• Electronics encapsulating
•  Plotting RF Transmitters

Features

• Convenient mix ratio
•  Moisture and chemically resistant
•  Room temperature cure
•  Physical shock resistant
• Low shrinkage
•  Non-Acrylate Containing

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