Search results for "substrate primers"

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CIM ECO Epoxy Primer

A two-component, solvent free epoxy coating formulated for porous and non-porous surfaces such as concrete, wood and metal.

From $450.00
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Tapecoat Omniprime

A single component universal primer which can be used with Tapecoat cold or hot applied tapes. Meets the most stringent VOC regulations. It is the required primer for TC20, 6025, HT/MB for applications up to 180F.

From $582.50
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CIM EMT Primer

A two-component, 97% solids moisture tolerant epoxy coating formulated as a primer for porous surfaces.

From $769.00
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Roybond 713B

A low V.O.C., fast drying, single component, primer to be applied on properly prepared surfaces prior to the placement of Royston® sheet membranes.

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Roybond 750

A spray applied, solvent based, fast drying, single component, primer to be applied on properly prepared surfaces prior to the placement of Royston® sheet membranes.

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Roybond 713A

A solvent based, fast drying, single component, primer to be applied on properly prepared surfaces prior to the placement of Royston® sheet membranes.

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CIM VOC Compliant Bonding Agent

An organo-silane compound dispersed in acetone, formulated to improve the adhesion of high-performance coatings and linings to non-porous surfaces that are past allowable recoat window.

From $834.00
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Eva Pox Bonder #1

A 100% solids, two component, moisture insensitive, modified epoxy adhesive specifically designed for adhering pre-formed closed cell joint seals to a variety of substrates.

From $231.00
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754 Low VOC Tac Coat

A low VOC, solvent based tack coat designed to be used as a bond coat between a substrate and Rosphalt modified asphalt overlay.

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Roybond 740

A low temperature, solvent based, fast drying, single component, primer to be applied on properly prepared surfaces prior to the placement of Royston® sheet membranes.

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Tapecoat H35

A 35 mil thick, an anti-corrosion cold applied tape suitable for above/below ground application on small to medium pipes.

From $450.00
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Tapecoat Moldable Sealant

A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate.

From $485.00
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