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A highly compressible, silicone gap filler with moderate bulk conductivity and low surface tack on both sides of the pad. This filler uses foam reinforcement to maintain compressibility. It is ideal for use in low-power applications requiring heat transfer across any large airgap.
A highly compressible, silicone gap filler with moderate bulk conductivity and low surface tack on both sides of the pad. This filler uses foam reinforcement to maintain compressibility. It is ideal for use in low-power applications requiring heat transfer across any large airgap.
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This highly compressible silicone gap filler offers moderate bulk conductivity and a highly conductive non-tacky surface on one side. Foam reinforcement ensures easy handling, simplifies application, and enhances long-term reliability.
This fiberglass-reinforced soft gel pad delivers thermal conductivity, electrical insulation, and flame resistance. With a non-tack side for easy heat sink removal, it fills gaps between heat-generating components and complex boards or chassis.
This fiberglass-reinforced thermal pad provides 3.5W/mK conductivity with low surface tack on one side, enabling efficient heat transfer in switching devices, robotic automation power boards, and high-kilowatt solar microinverters.
This fiberglass-reinforced soft gel pad offers thermal conductivity, electrical insulation, and flame resistance. With low tack on one side, it fills gaps between heat-generating components and heat sinks, boards, or chassis requiring complex shapes.
This fiberglass-reinforced thermal pad offers 3.5W/mK conductivity with low surface tack on both sides, enabling efficient heat transfer in switching devices, robotic automation power boards, and high-kilowatt solar microinverters.