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A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability. It is ideal for use in low-power applications requiring heat transfer across any large air gap
A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability. It is ideal for use in low-power applications requiring heat transfer across any large air gap
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A highly compressible, silicone gap filler with moderate bulk conductivity and low surface tack on both sides of the pad. This filler uses foam reinforcement to maintain compressibility.
This fiberglass-reinforced thermal pad provides 3.5W/mK conductivity with low surface tack on one side, enabling efficient heat transfer in switching devices, robotic automation power boards, and high-kilowatt solar microinverters.
This fiberglass-reinforced soft gel pad delivers thermal conductivity, electrical insulation, and flame resistance. With a non-tack side for easy heat sink removal, it fills gaps between heat-generating components and complex boards or chassis.
This fiberglass-reinforced soft gel pad provides thermal conductivity, electrical insulation, and flame resistance. With low tack on both sides, it fills gaps between heat-generating components and complex chassis, boards, or heat sinks.
This fiberglass-reinforced soft gel pad provides thermal conductivity and electrical insulation. With low tack on both sides, it fills gaps between heat-generating components and heat sinks, boards, or chassis requiring complex die-cut shapes.