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A green, two-part, thixotropic epoxy adhesive that cures at room temperature. It is designed for non-sag structural bonding application that requires a room temperature curing epoxy with low shrinkage, good shock resistance and excellent mechanical and electrical properties as well as good toleration to moisture or damp surface while bonding. It cures to form tough bonds to metals, phenolic plastics, polymers, glass, FRP’s, hard boards, wood, ceramics, rubber and masonry materials. It is an excellent electric insulator and provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels and salt solutions.
A green, two-part, thixotropic epoxy adhesive that cures at room temperature. It is designed for non-sag structural bonding application that requires a room temperature curing epoxy with low shrinkage, good shock resistance and excellent mechanical and electrical properties as well as good toleration to moisture or damp surface while bonding. It cures to form tough bonds to metals, phenolic plastics, polymers, glass, FRP’s, hard boards, wood, ceramics, rubber and masonry materials. It is an excellent electric insulator and provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels and salt solutions.
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A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages.
A two component, 100% solids, high-temperature epoxy with a maximum service temperature of 300°F (149°C). It can be used as a standalone pipeline coating or as a primer for Tapecoat High-Temperature Tapes.
This product was developed to mix, apply, and cure underwater. This product is a very versatile adhesive that will work on most applications.
A medium viscosity epoxy resin system designed for industrial adhesion, small potting, and laminating applications where a fast process cure is required.
A two-part, 100% solids, Zero VOC, below grade, fast curing epoxy with a maximum service temperature is 300°F (149°C), and can be backfilled in 2-3 hours at 70°F and 50% relative humidity.