Search results for "encapsulants"
A fast curing, water white, urethane acrylate designed for utilization as an LCD interface adhesive.
A room temperature curing, two part polyurethane system designed to be used for high performance adhesive applications where low stress over a wide temperature range is required.
A fast curing urethane acrylate that bonds well to engineered plastics, glass and metal based substrates. This product requires direct UV exposure during cure.
A fast curing epoxy adhesive. This two part epoxy cures at room temperature and provides high strength bonds to a wide variety of substrates.
A fast curing, clear, urethane acrylate designed for use as an LCD interface adhesive. This product is a soft, flexible, low modulus polymer that provides a high bond strength without imparting stress.
A fast curing, clear, urethane acrylate designed for use as an LCD interface adhesive.
A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages.
HumiSeal® 2C51 is a two-component high strength, fast curing silicone encapsulating gel supplied as Parts A and B, suitable for general printed circuit board applications.
HumiSeal® 2E11 is a room temperature curing two-part epoxy system designed for electronic sealing, encapsulating and potting applications.
A 60 mil, VOC Exempt, UV resistant, cold applied, self- hardening, wax-based tape formulated to protect piping and metal structures from damage and deterioration caused by corrosion.
