Epoxy Adhesives

A two-component system recommended for bonding applications where high shock impact resistance and peel resistance are desired. It develops strong bonds to a wide range of materials, including plastics, metals, ceramics, and glass.

A two-component system recommended for bonding applications where high shock impact resistance and peel resistance are desired. It develops strong bonds to a wide range of materials, including plastics, metals, ceramics, and glass.

A two-part system recommended for bonding applications where a moderate working time is required but with a short handling-strength time.

This product was developed to mix, apply, and cure underwater. This product is a very versatile adhesive that will work on most applications.

This two-part, green epoxy adhesive cures at room temperature for non-sag structural bonding. It offers low shrinkage, strong shock resistance, reliable mechanical and electrical properties, and performs well on damp surfaces.

A fast curing epoxy adhesive. This two part epoxy cures at room temperature and provides high strength bonds to a wide variety of substrates.

A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages.