封装解决方案
封装液用于保护设备免受极端操作条件、机械应力和电击的影响。HumiSeal灌封化合物是由环氧树脂、聚氨酯或丙烯酸聚氨酯配制而成。它们的设计具有各种固化机制，以满足您所有的汽车、航空航天、工业或消费应用的要求。我们对您的需求的承诺超越了标准产品组合，因为我们将定制产品以满足您的确切需求。
HumiSeal Encapsulation Solutions
| 封装剂 | Viscosity Part A (CPs) | Viscosity Part B (CPs) | 完全治愈** | 治愈类型 | 硬度 | |
|---|---|---|---|---|---|---|
| 2E11 | Formulated to work with 1:2 volume mix-ratio, this potting material provides superior adhesion to variety of substrates. Medium viscosity with long work life. | 12,000 | 6,000 | 24 hr @ RT or 1 hr @ 65°C | 双组分，带加热选项 | D40 |
| 2E16 | Transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium sized electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments. | 1,000 | 90 | 48 hr @ RT | 2个组成部分 | A55 |
| 2E25 | Epoxy adhesive or encapsulant with range of mix ratios and hardness resulting in high bond strength to variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant. | 12,000 | 14,000 | 12 hr @ RT or 2 hrs @ 65°C | 双组分，带加热选项 | D64至D80 |
| 2A13 | Low stress elastic encapsulant with low viscosity and simple 1:1 mix ratio. Protection to the electronic package when exposed to multiple thermal shocks and high vibration. | 12,000 | 7,000 | 24 hr @ RT or 1 hr @ 65°C | 双组分，带加热选项 | A30 |
| 2A14-U | High performance potting and encapsulation applications with 1:2 mix ratio. This fast setting potting material and encapsulant cures to a tough, moisture resistant and flexible polymer. Good for multiple thermal cycle requirements or high mechanical shock applications. | 2,000 | 2,500 | 24小时@RT | 双组分，带加热选项 | A90 |
| 2A15-B | Two part 1:2 mix ratio, polyurethane system designed to be used for high performance potting and encapsulation applications. Tough flexible polymer for the protection of electronics when exposed to multiple thermal shocks and high vibration. | 1,000 | 12,000 | 24小时@RT | 双组分，带加热选项 | A90 |
| 2A16 | Room temperature curing, two part polyurethane system designed to be used for high performance potting and encapsulation applications. This two to one mix ratio product cures at room temperature to a tough flexible polymer. | 17,000 | 8,000 | 7 days @ RT or 2hr @ 65°C | 2 component with heat option | A50 |
| 2C51 | Two component high strength, fast curing silicone suitable for general sealing and encapsulating. Low viscosity 1:1 mix ratio with fast room temperature cure for ease of application. | 275 | 550 | 1 hr @ RT or 30 min @ 70°C | 2 component with heat option | 00-45 |
| 2C52 | Fast curing, two part silicone for applications requiring a soft, high surface tack sealant. Simple 1:1 mixture with limited flow-ability after dispensing. Adheres and seals most surfaces but can be easily removed and repaired after curing. | 17,500 | 15,000 | 1 hr @ RT or 2 min @ 125°C | 2 component with heat option | <00 0 |
| UV14 | Fast Curing urethane acrylate system for adhesion to difficult to bond plastics. In addition to the UV cure this material has a secondary moisture cure mechanism to ensure cure in areas shadowed in UV light. This product also has excellent resistance to moisture and maintains flexibility at low temperatures. | 22,000 | - | 24小时@RT | 紫外线/湿气 | D50 |
| 2UV10 | Two component UV gellable urethane with 1:2 mix ratio. Tack free surface and functional strength is achieved with UV exposure. The secondary reaction ensures shadowed areas are completely polymerized. High elongation and bond strength ensures protection of electronics against thermal shock and mechanical stresses. | 100,000 | 60,000 | 24小时@RT | UV-gelable w/ 2 component | D39 |
HumiSeal Encapsulants Thermally Conductive
| 封装剂 | Viscosity Part A (CPs) | Viscosity Part B (CPs) | 完全治愈** | 治愈类型 | 硬度 | |
|---|---|---|---|---|---|---|
| Two part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with medium-high viscosity. Excellent dielectric strength (500V/mil). | 20,000 | 24,000 | 24 hr @ RT or 2 hr @ 65°C | 双组分，带加热选项 | D60 | |
| 2E42T-B | Two part, thermally conductive (0.83 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ratio with medium-high viscosity. Excellent dielectric strength (500V/mil). | 35,000 | 30,000 | 24 hr @ RT or 2 hr @ 65°C | 2 component with heat option | D65 |