Adhesives Solutions

Adhesives Solutions

HumiSeal adhesives are used to bond a variety of materials capable of withstanding mechanical shock, electrical exposure, and severe weathering. These are formulated from urethane or epoxy and are effectively cured with UV light, heat, or at ambient temperature. If your application requires a set of properties that are not available in standard product portfolio, we can provide a custom solution.

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Adhesives / Reference Chart

Adhesive Reference Chart

 HumiSeal® 2A20

General purpose adhesive or encapsulant. Medium viscosity with 1:1 mix ratio. Medium hardness with good flexibility. A wide range of applications with bonding capabilities to multiple substrates.

  • Chemistry: Urethane
  • Pot life (min):<8
  • Substrates:Metals, Hard to Bond Plastics, Glass, Ceramics, PolyCarb, Electronics

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 HumiSeal® 2A20HV

General purpose adhesive or encapsulant. High viscosity with 1:1 mix ratio and long work life. Medium hardness with good flexibility. A wide range of applications with bonding capabilities to multiple substrates

  • Chemistry: Urethane
  • Pot life (min):30
  • Substrates:Metals, Hard to Bond Plastics, Glass, Ceramics, PolyCarb, Electronics

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 HumiSeal® 2E24

Toughened 5 min epoxy adhesive capable of performing at low temperatures and bonding to wet surfaces. Thixotropic with 1:1 mix ratio. Will bond to a variety of substrates.

  • Chemistry: Epoxy
  • Pot life (min):5
  • Substrates:Metals, Glass, Ceramics, Plastic

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 HumiSeal® 2E25

Epoxy adhesive or encapsulant with a range of mix ratios and hardness resulting in high bond strength to a variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant.

  • Chemistry: Epoxy
  • Pot life (min):69
  • Substrates:Metals, Glass, Ceramics, Plastic

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 HumiSeal® 2E26

Toughened adhesive or encapsulant designed for high humidity environments. High viscosity with 2:1 mix ratio. High resistance to physical shock, exposure to water, or chemicals.

  • Chemistry: Epoxy
  • Pot life (min):120
  • Substrates:Metals, Plastics

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 HumiSeal® UV22

One part, med-high viscosity, fast curing urethane acrylate that bonds a wide variety of different substrates. A toughened adhesive that exhibits good surface wetting and adhesion to glass, metals, and a wide variety of plastic-based substrates.

  • Chemistry: Urethane/Acrylate
  • Pot life (min): Until exposed to UV
  • Substrates: Metals, Glass, Ceramics, Plastic

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HumiSeal® UV21

One-part, medium viscosity, fast curing urethane acrylate that bonds a wide variety of different substrates. Exhibits good surface wetting and adhesion to glass, metals, and a wide variety of plastic based substrates

  • Chemistry: Urethane/Acrylate
  • Pot life (min): Until exposed to UV
  • Substrates: Metals, Glass, Ceramics, Plastic

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HumiSeal® UV23 LV

High strength, chemical resistant, low outgassing polymer system capable of surviving exposure up to 200°C. One part, UV/cationic cure epoxy adhesive.

  • Chemistry: Epoxy
  • Pot life (min):Until exposed to UV
  • Substrates:Metals, Glass, Ceramics, Plastic

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 HumiSeal® 1E31-G

One part, thixotropic, Silver filled epoxy system to be used as a solder replacement. Quick cure providing excellent electrical conductivity (3×10-4Ω* cm.), high temperature and chemical resistance.

  • Chemistry: Epoxy
  • Pot life (min): Heat exposure
  • Substrates: Metals, Plastics

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 HumiSeal® 2E32-G

Two-part, silver filled epoxy system designed to be used as a solder replacement. Can be cured at room temperature in 24-48 hours or accelerated with heat. Provides a high amount of flexibility, excellent electrical conductivity (3×10-4 Ω*cm), and chemical resistance. Strong bonds between dissimilar materials, complies with NASA Outgassing Specification.

  • Chemistry: Epoxy
  • Pot life (min):60
  • Substrates:Metals, Plastics

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 HumiSeal® 2E33-G

Long work life, two-part, silver filled epoxy system designed to be used as a solder replacement. Thixotropic cured at room temperature in 24-48 hours or accelerated with heat. Provides a high amount of flexibility, excellent electrical conductivity (1×10-4 Ω*cm), and chemical resistance.

  • Chemistry: Epoxy
  • Pot life (min):100
  • Substrates:Metals, Plastics

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