Soluciones de encapsulación

Soluciones de encapsulación

Los líquidos encapsulantes se utilizan para proteger los dispositivos de condiciones de funcionamiento extremas, tensiones mecánicas y descargas eléctricas. Los compuestos de encapsulado HumiSeal están formulados con epoxi, uretano o uretanos acrilados. Están diseñados con una variedad de mecanismos de curado para adaptarse a todos los requisitos de las aplicaciones de automoción, aeroespaciales, industriales o de consumo. Nuestro compromiso con sus necesidades va más allá de la cartera de productos estándar, ya que formularemos un producto a medida que se ajuste a sus necesidades exactas.

Tabla de referencia de dureza/viscosidad de los encapsulantes

Dureza del encapsulante : Tabla de referencia de la viscosidad

HumiSeal Encapsulation Solutions

EncapsulantesViscosity
Part A (CPs)
Viscosity
Part B (CPs)
Cura completa**Tipo de curaDureza
2E11

Formulated to work with 1:2 volume mix-ratio, this potting material provides superior adhesion to variety of substrates. Medium viscosity with long work life.12,0006,00024 hr @ RT or
1 hr @ 65°C
2 componentes con opción de calorD40
2E16

Transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium sized electronic packages.
This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments.
1,0009048 hr @ RT2 componentesA55
2E25Epoxy adhesive or encapsulant with range of mix ratios and hardness resulting in high bond strength to variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant.12,00014,00012 hr @ RT or
2 hrs @ 65°C
2 componentes con opción de calorD64 a D80
2A13Low stress elastic encapsulant with low viscosity and simple 1:1 mix ratio. Protection to the electronic package when exposed to multiple thermal shocks and high vibration.12,0007,00024 hr @ RT or
1 hr @ 65°C
2 componentes con opción de calorA30
2A14-UHigh performance potting and encapsulation applications with 1:2 mix ratio. This fast setting potting material and encapsulant cures to a tough, moisture resistant and flexible polymer. Good for multiple thermal cycle requirements or high mechanical shock applications.2,0002,50024 horas @ RT 2 componentes con opción de calorA90
2A15-BTwo part 1:2 mix ratio, polyurethane system designed to be used for high performance potting and encapsulation applications. Tough flexible polymer for the protection of electronics when exposed to multiple thermal shocks and high vibration.1,00012,00024 horas @ RT
2 componentes con opción de calorA90
2A16

Room temperature curing, two part polyurethane system designed to be used for high performance potting and encapsulation applications.
This two to one mix ratio product cures at room temperature to a tough flexible polymer.
17,0008,0007 days @ RT or
2hr @ 65°C
2 component
with heat option
A50
2C51

Two component high strength, fast curing silicone suitable for general sealing and encapsulating. Low viscosity 1:1 mix ratio with fast room temperature cure for ease of application.2755501 hr @ RT or
30 min @ 70°C
2 component
with heat option
00-45
2C52

Fast curing, two part silicone for applications requiring a soft, high surface tack sealant.
Simple 1:1 mixture with limited flow-ability after dispensing. Adheres and seals most surfaces but can be easily removed and repaired after curing.
17,50015,0001 hr @ RT or
2 min @ 125°C
2 component
with heat option
<00 0
UV14

Fast Curing urethane acrylate system for adhesion to difficult to bond plastics. In addition to the UV cure this material has a secondary moisture cure mechanism to ensure cure in areas shadowed in UV light. This product also has excellent resistance to moisture and maintains flexibility at low temperatures.22,000-24 horas @ RTUV/humedadD50
2UV10

Two component UV gellable urethane with 1:2 mix ratio. Tack free surface and functional strength is achieved with UV exposure.
The secondary reaction ensures shadowed areas are completely polymerized. High elongation and bond
strength ensures protection of electronics against thermal shock and mechanical stresses.
100,00060,00024 horas @ RTUV-gelable
w/ 2 component
D39

HumiSeal Encapsulants Thermally Conductive

EncapsulantesViscosity
Part A (CPs)
Viscosity
Part B (CPs)
Cura completa**Tipo de curaDureza
2E41T-B

Two part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics.
Simple 1:1 mix ration with medium-high viscosity. Excellent dielectric strength (500V/mil).
20,00024,00024 hr @ RT or
2 hr @ 65°C
2 componentes con opción de calorD60
2E42T-B

Two part, thermally conductive (0.83 W/mK) epoxy system designed for the protection of electronics.
Simple 1:1 mix ratio with medium-high viscosity. Excellent dielectric strength (500V/mil).
35,00030,00024 hr @ RT or
2 hr @ 65°C
2 component
with heat option
D65