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…relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. It also features good chemical, and thermal degradation resistance. TechFilm E2313F will cure…

…of thermal expansion, moderately high glass transition temperature, and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C. Applications: Electronic board assembly Features Chemical, heat, moisture…

…to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance. Applications: All purpose bonding Piezoelectric sensor Features High thermal conductivity Chemical, heat,…

…at temperatures above 90°C. It features good chemical, heat, and moisture resistance. Applications: General purpose adhesive Electronics board laminate Features Chemical, heat, moisture resistant Electrically insulative B-staged film Need more…

…temperature and good adhesion to gold and other hard to bond metals. It also features good chemical, heat, and moisture resistance. TechFilm I2202F will cure at temperatures above 115C. Applications:…

…temperature and good adhesion to gold and other hard to bond metals. It also features good chemical, heat, and moisture resistance. TechFilm I2202F will cure at temperatures above 115C. Applications:…

…113-107 is designed for bonding, potting, and encapsulating electrical components. Applications: Electronics bonding Electronics encapsulating Electronics potting Features Flowable Extended work life Chemical resistance Environmental resistance Electrical insulator Need more…