B-Stage Epoxy T2222F
T2222F: THERMALLY CONDUCTIVE FILM
TechFilm T2222F is a high performance thermally conductive B-staged film adhesive specially formulated for bonding to gold, nickel, and other hard to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance.
- All purpose bonding
- Piezoelectric sensor
- High thermal conductivity
- Chemical, heat, moisture resistant
- B-staged film