B-Stage Epoxy T2222F

B-stage Epoxy Film

B-Stage Epoxy T2222F

T2222F: THERMALLY CONDUCTIVE FILM

Product Description

TechFilm T2222F is a high performance thermally conductive B-staged film adhesive specially formulated for bonding to gold, nickel, and other hard to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance.

Applications: 

  • All purpose bonding
  • Piezoelectric sensor

Features

  •  High thermal conductivity
  • Chemical, heat, moisture resistant
  • B-staged film
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