Epoxy Adhesives
Humiseal epoxy adhesives perform in the most challenging environments due to their robust curing mechanism and resulting strength. Epoxies are used in industries including electronics, automotive, and health care devices among others. Humiseal epoxy adhesives are supplied as 2 components, chemical cure systems. Advantages and properties of Humiseal epoxies include:
- fast and efficient chemical cure
- excellent electrical insulation
- resistant to many chemicals and gases
- excellent bonds to most traditional substrates.
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Toughened adhesive or encapsulant designed for high humidity environments. High viscosity with 2:1 mix ratio. High resistance to physical shock, exposure to water, or chemicals.
- Chemistry: Epoxy
- Pot life (min):120
- Substrates:Metals, Plastics
Long work life, two-part, silver filled epoxy system designed to be used as a solder replacement. Thixotropic cured at room temperature in 24-48 hours or accelerated with heat. Provides a high amount of flexibility, excellent electrical conductivity (1×10-4 Ω*cm), and chemical resistance.
- Chemistry: Epoxy
- Pot life (min):100
- Substrates:Metals, Plastics
Toughened 5 min epoxy adhesive capable of performing at low temperatures and bonding to wet surfaces. Thixotropic with 1:1 mix ratio. Will bond to a variety of substrates.
- Chemistry: Epoxy
- Pot life (min):5
- Substrates:Metals, Glass, Ceramics, Plastic
Epoxy adhesive or encapsulant with a range of mix ratios and hardness resulting in high bond strength to a variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant.
- Chemistry: Epoxy
- Pot life (min):69
- Substrates:Metals, Glass, Ceramics, Plastic
One part, thixotropic, Silver filled epoxy system to be used as a solder replacement. Quick cure providing excellent electrical conductivity (3×10-4Ω* cm.), high temperature and chemical resistance.
- Chemistry: Epoxy
- Pot life (min): Heat exposure
- Substrates: Metals, Plastics
Two-part, silver filled epoxy system designed to be used as a solder replacement. Can be cured at room temperature in 24-48 hours or accelerated with heat. Provides a high amount of flexibility, excellent electrical conductivity (3×10-4 Ω*cm), and chemical resistance. Strong bonds between dissimilar materials, complies with NASA Outgassing Specification.
- Chemistry: Epoxy
- Pot life (min):60
- Substrates:Metals, Plastics