Encapsulation Solutions
Encapsulating liquids are used to protect devices from extreme operating conditions, mechanical stresses, and electrical shock. HumiSeal potting compounds are formulated from epoxy, urethane or acrylated urethanes. They are engineered with a variety of cure mechanisms to fit all your automotive, aerospace, industrial, or consumer application requirements. Our commitment to your needs goes beyond the standard product portfolio, as we will custom formulate a product to fit your exact needs.
HumiSeal Encapsulation Solutions
| Encapsulants | Viscosity Part A (CPs) | Viscosity Part B (CPs) | Full Cure** | Cure Type | Hardness | |
|---|---|---|---|---|---|---|
| 2E11 | Formulated to work with 1:2 volume mix-ratio, this potting material provides superior adhesion to variety of substrates. Medium viscosity with long work life. | 12,000 | 6,000 | 24 hr @ RT or 1 hr @ 65°C | 2 component with heat option | D40 |
| 2E16 | Transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium sized electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments. | 1,000 | 90 | 48 hr @ RT | 2 component | A55 |
| 2E25 | Epoxy adhesive or encapsulant with range of mix ratios and hardness resulting in high bond strength to variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant. | 12,000 | 14,000 | 12 hr @ RT or 2 hrs @ 65°C | 2 component with heat option | D64 to D80 |
| 2A13 | Low stress elastic encapsulant with low viscosity and simple 1:1 mix ratio. Protection to the electronic package when exposed to multiple thermal shocks and high vibration. | 12,000 | 7,000 | 24 hr @ RT or 1 hr @ 65°C | 2 component with heat option | A30 |
| 2A14-U | High performance potting and encapsulation applications with 1:2 mix ratio. This fast setting potting material and encapsulant cures to a tough, moisture resistant and flexible polymer. Good for multiple thermal cycle requirements or high mechanical shock applications. | 2,000 | 2,500 | 24 hr @ RT | 2 component with heat option | A90 |
| 2A15-B | Two part 1:2 mix ratio, polyurethane system designed to be used for high performance potting and encapsulation applications. Tough flexible polymer for the protection of electronics when exposed to multiple thermal shocks and high vibration. | 1,000 | 12,000 | 24 hr @ RT | 2 component with heat option | A90 |
| 2A16 | Room temperature curing, two part polyurethane system designed to be used for high performance potting and encapsulation applications. This two to one mix ratio product cures at room temperature to a tough flexible polymer. | 17,000 | 8,000 | 7 days @ RT or 2hr @ 65°C | 2 component with heat option | A50 |
| 2C51 | Two component high strength, fast curing silicone suitable for general sealing and encapsulating. Low viscosity 1:1 mix ratio with fast room temperature cure for ease of application. | 275 | 550 | 1 hr @ RT or 30 min @ 70°C | 2 component with heat option | 00-45 |
| 2C52 | Fast curing, two part silicone for applications requiring a soft, high surface tack sealant. Simple 1:1 mixture with limited flow-ability after dispensing. Adheres and seals most surfaces but can be easily removed and repaired after curing. | 17,500 | 15,000 | 1 hr @ RT or 2 min @ 125°C | 2 component with heat option | <00 0 |
| UV14 | Fast Curing urethane acrylate system for adhesion to difficult to bond plastics. In addition to the UV cure this material has a secondary moisture cure mechanism to ensure cure in areas shadowed in UV light. This product also has excellent resistance to moisture and maintains flexibility at low temperatures. | 22,000 | - | 24 hr @ RT | UV/moisture | D50 |
| 2UV10 | Two component UV gellable urethane with 1:2 mix ratio. Tack free surface and functional strength is achieved with UV exposure. The secondary reaction ensures shadowed areas are completely polymerized. High elongation and bond strength ensures protection of electronics against thermal shock and mechanical stresses. | 100,000 | 60,000 | 24 hr @ RT | UV-gelable w/ 2 component | D39 |
HumiSeal Encapsulants Thermally Conductive
| Encapsulants | Viscosity Part A (CPs) | Viscosity Part B (CPs) | Full Cure** | Cure Type | Hardness | |
|---|---|---|---|---|---|---|
| 2E41T-B | Two part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with medium-high viscosity. Excellent dielectric strength (500V/mil). | 20,000 | 24,000 | 24 hr @ RT or 2 hr @ 65°C | 2 component with heat option | D60 |
| 2E42T-B | Two part, thermally conductive (0.83 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ratio with medium-high viscosity. Excellent dielectric strength (500V/mil). | 35,000 | 30,000 | 24 hr @ RT or 2 hr @ 65°C | 2 component with heat option | D65 |