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…to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance. Applications: All purpose bonding Piezoelectric sensor Features High thermal conductivity Chemical, heat,…

…at temperatures above 90°C. It features good chemical, heat, and moisture resistance. Applications: General purpose adhesive Electronics board laminate Features Chemical, heat, moisture resistant Electrically insulative B-staged film Need more…

…temperature and good adhesion to gold and other hard to bond metals. It also features good chemical, heat, and moisture resistance. TechFilm I2202F will cure at temperatures above 115C. Applications:…

…temperature and good adhesion to gold and other hard to bond metals. It also features good chemical, heat, and moisture resistance. TechFilm I2202F will cure at temperatures above 115C. Applications:…

…encapsulate small to medium-sized electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments. Hybrid Polymer 131-77MX also bonds readily to…

…113-107 is designed for bonding, potting, and encapsulating electrical components. Applications: Electronics bonding Electronics encapsulating Electronics potting Features Flowable Extended work life Chemical resistance Environmental resistance Electrical insulator Need more…

…Features Room temperature cure Moisture and chemically resistant Physical shock resistant Need more information? Contact Resin Designs Quick Links Blog Need to Talk? Technical Data Sheet Request a Sample arrows…

Epoxy Encapsulants -040208-2 EPOXY 040208-2: HIGH THERMAL K EPOXY ENCAPSULANT Product Description Epoxy 040208-2 is a room temperature curing, two part epoxy system designed to be used to encapsulate electronic…