Adhesives and EncapsulantsAdhesives and EncapsulantsAdhesives and EncapsulantsChase Corporation offers a focused portfolio of epoxies, adhesives and encapsulants engineered for strong bonding, electrical insulation, environmental protection, and long-term reliability. From 4EvaWeld™ and 4EvaFill™ epoxy putty sticks for fast, dependable repairs to advanced adhesive systems for industrial assembly, our solutions help simplify application while delivering durable performance.
For electronics protection, ThermoSink thermally conductive encapsulants provide effective thermal management while shielding sensitive components from moisture, mechanical stress, and harsh operating conditions. Together, these repair, bonding, and encapsulation technologies support demanding applications across electronics, manufacturing, maintenance, and industrial environments.
Discover the perfect repair solution with 4EvaWeld™ Putty Sticks, available in three versatile versions to tackle any project. Whether you need the quick-setting convenience of 4EvaWeld™, the extended working time of 4EvaWeld™ Slow Cure, or the heavy-duty strength of 4EvaWeld™ UltraMax, each formula is designed for easy, mess-free use. Simply mix by hand to create a durable bond on metals, plastics, composites, and more. With features like oil resistance, wet and dry application, and the ability to sand, drill, tap, and paint after curing, 4EvaWeld™ makes repairs and restorations effortless. Click to learn more about which version is right for your next project!
Chase Corporation’s HumiSeal and Resin Designs encapsulants deliver advanced protection for PCBs and sensitive components. By resisting moisture and corrosion, absorbing mechanical shock, and ensuring electrical insulation, they safeguard electronics for consistent performance in harsh conditions. Their low shrinkage and durable design maintain structural integrity while reducing stress on delicate components. Choose solutions that provide precision and confidence for professional applications.
Chase Corporation’s UV and epoxy adhesives offer distinct benefits tailored to specific applications. UV adhesives cure rapidly under ultraviolet light, ensuring efficiency for glass, optical bonding, and electronics assembly. Epoxy adhesives deliver exceptional strength, chemical resistance, and long-term durability, making them ideal for structural bonding and encapsulation. Each option provides reliable performance and application flexibility to meet diverse industrial needs.
Chase Corporation offers one-component and two-component adhesives tailored to diverse industrial needs. One-component adhesives simplify application with pre-mixed formulations that cure efficiently using heat, moisture, or UV exposure, making them ideal for automated processes. Two-component adhesives, mixed at the point of use, deliver exceptional bonding strength, chemical resistance, and durability, ensuring reliability for demanding structural applications. Explore advanced adhesive solutions designed to maximize efficiency and performance.
