TechFilm B-stage Epoxy

B-Stage Epoxy Film

B-stage Epoxy FilmB-Stage Epoxy Film

B-Stage epoxy film is thermosetting resins with high cohesive strength and excellent adhesion to metals, ceramics, glass, rubber, and some plastics. They are generally rigid and have excellent chemical resistance. Epoxy film enables clean, consistent bond lines and manufacturing that eliminates dispensing of liquids.

 

 

 

 

 

 

 

 

 

 

Structural

Product

I2202F

TechFilm I2202F is a high-performance B-staged film adhesive. It features relatively high flow with good wetting properties, fairly high glass transition temperature and good adhesion to gold and other hard to bond metals. It also features good chemical, heat, and moisture resistance. TechFilm I2202F will cure at temperatures above 115C.
I2300F I2300F is a high-performance B-staged film adhesive developed for higher temperature applications. It features a relatively high flow, a high glass transition temperature. It also features good chemical, heat, and moisture resistance. I2300F will cure at temperatures above 160°C.
I2500F I2500F is a high-performance B-staged film adhesive. It features relatively high flow with good wetting properties and fairly high glass transition temperature. I2500F will cure at temperatures above 130°C.
I2701F TechFilm I2701F is a high performance electrically isolating B-staged film adhesive specially formulated for bonding at lower temperatures. TechFilm I2701F will cure at temperatures above 90°C. It features good chemical, heat, and moisture resistance.

 

Thermal

Product

Description

T2222F

TechFilm T2222F is a high performance thermally conductive B-staged film adhesive specially formulated for bonding to gold, nickel, and other hard to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance.

T2321F

TechFilm T2321F is a high performance, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, high glass transition temperature and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance.

T2723F

TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, moderately high glass transition temperature, and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C.

T2521F

TechFilm T2321F is a high performance, highly thermally conductive electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, high glass transition temperature and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance.

T2526F

TechFilm T2526F is a high performance, thermally conductive and electrically insulating, B-staged film adhesive cast from 100% solids. It features a relatively low coefficient of thermal expansion, high glass transition temperature, and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance. TechFilm T2526F will cure at temperatures above 130°C.

T2781F

TechFilm T2781F is a high performance, high thermally conductive/electrically insulating, B-staged film adhesive. It features a fast cure time, high thermal conductivity, and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance. TechFilm T2781F will cure at temperatures above 100C.

 

Electrical

Product

Description

E2214F

TechFilm E2214F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2214F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 120C and features good chemical, heat, and moisture resistance.

E2313F

TechFilm E2313F is a high performance, electrically conductive, B-staged film adhesive developed for higher temperature applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. It also features good chemical and thermal degradation resistance. TechFilm E2313F will cure at temperatures above 160°C.

E2514F

TechFilm E2514F is a high performance, electrically conductive, B-staged film adhesive developed for general purpose grounding applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. It also features good chemical and thermal degradation resistance. TechFilm E2514F will cure at temperatures above 130°C.

E2713F

TechFilm E2713F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2713F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 90C and features good chemical, heat, and moisture resistance.

E2771F

TechFilm E2713F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2713F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 90C and features good chemical, heat, and moisture resistance.

Quick Links

B-Stage Application Process

Step 1- B-Stage: Remove rolls or cut parts from frozen storage area

Step 1: Remove rolls or cut parts from frozen storage area and rolls or parts from “clamshell” packaging

Step 2 -B-stage Allow parts to acclimatize to ambient temperature for 1-2 hrs

Step 2: Allow parts to acclimatize to ambient temperature for 1-2 hrs.

Step 3 -B-stage remove the liner

Step 3: Remove release paper liner from 1 side

Step 4-B-stage apply firmly

Step 4:Apply adhesive film to desired part and press firmly and expose to recommended heat and pressure conditions for appropriate time

Need more information?
Talk to us

Contact Us