B-Stage Epoxy Film
B-Stage Epoxy Film
B-Stage epoxy film is thermosetting resins with high cohesive strength and excellent adhesion to metals, ceramics, glass, rubber, and some plastics. They are generally rigid and have excellent chemical resistance. Epoxy film enables clean, consistent bond lines and manufacturing that eliminates dispensing of liquids.
Resin Designs Structural B-Stage Epoxy Film
| Product | Description |
|---|---|
| TechFilm I2202F is a high-performance B-staged film adhesive. It features relatively high flow with good wetting properties, fairly high glass transition temperature and good adhesion to gold and other hard to bond metals. It also features good chemical, heat, and moisture resistance. TechFilm I2202F will cure at temperatures above 115C. | |
| I2300F is a high-performance B-staged film adhesive developed for higher temperature applications. It features a relatively high flow, a high glass transition temperature. It also features good chemical, heat, and moisture resistance. I2300F will cure at temperatures above 160°C. | |
| I2500F is a high-performance B-staged film adhesive. It features relatively high flow with good wetting properties and fairly high glass transition temperature. I2500F will cure at temperatures above 130°C. | |
| TechFilm I2701F is a high performance electrically isolating B-staged film adhesive specially formulated for bonding at lower temperatures. TechFilm I2701F will cure at temperatures above 90°C. It features good chemical, heat, and moisture resistance. |
Resin Designs Thermal B-Stage Epoxy Film
| Product | Description |
|---|---|
| TechFilm E2772F is a high performance thermally conductive B-staged film adhesive specially formulated for bonding to gold, nickel, and other hard to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance. | |
| TechFilm T2321F is a high performance, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, high glass transition temperature and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance. | |
| TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, moderately high glass transition temperature, and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C. | |
| T2521P is a high performance thermally conductive B-stageable paste adhesive formulated to cure at temperatures above 130°C and features good chemical, heat, and moisture resistance. | |
| TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, moderately high glass transition temperature, and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C. |
Resin Designs Electrical B-Stage Epoxy Film
| Product | Description |
|---|---|
| TechFilm E2214F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2214F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 120C and features good chemical, heat, and moisture resistance. | |
| TechFilm E2313F is a high performance, electrically conductive, B-staged film adhesive developed for higher temperature applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. It also features good chemical and thermal degradation resistance. TechFilm E2313F will cure at temperatures above 160°C. | |
| TechFilm E2514F is a high performance, electrically conductive, B-staged film adhesive developed for general purpose grounding applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. It also features good chemical and thermal degradation resistance. TechFilm E2514F will cure at temperatures above 130°C. | |
| TechFilm E2713F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2713F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 90C and features good chemical, heat, and moisture resistance. | |
| TechFilm E2771F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2713F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 90C and features good chemical, heat, and moisture resistance. |
B-Stage Application Process
Step 1: Remove rolls or cut parts from frozen storage area and rolls or parts from “clamshell” packaging
Step 2: Allow parts to acclimatize to ambient temperature for 1-2 hrs.
Step 3: Remove release paper liner from 1 side
Step 4:Apply adhesive film to desired part and press firmly and expose to recommended heat and pressure conditions for appropriate time
