Thermal Gap Pads & Fillers

Thermal Gap Pads

Thermal Gap Pads & Fillers

Thermal Gap PadsLong-term, reliable protection of sensitive circuits and components is important in today’s delicate and demanding power electronics applications. With the increase in processing power, charging wattages and the trend toward smaller, more compact electronic modules, transfer of thermal energy to heat sinks, cooled chassis and other safe locations is essential in maintaining component temperatures within operating specification limits. Resin Designs’ family of thermal interface pads provide superior performance with a variety of thermal pad constructions to achieve excellent thermal protection and economic value over a wide range of applications.

  • Soft/compressible yet resilient and low compression set
  • Fully cured for improved thermal cycling without pump-out concerns
  • Provides low stress on the component
  • Perfect for non-parallel or rough surfaces
  • Consistency with manual application and minimal experience
  • TIM pads are easy to remove cleanly without solvent

Applications:

  • Consumer Products
  • Computers, laptops, servers, routers, switches
  • LEDs & lighting
  • Telecommunications
  • Automotive electronics
  • Electrical Inversion
  • Vibration dampening
  • Power PCB’s
Thin Thermal Gap Pads Gap Filler Thermal Pads
Fiberglass reinforced, cost-competitive and thermally conductive soft gel pads  UV Stability
​Flame retardant and electrically insulating UV Resistant Silicone Topping Required
Provides shock absorption and easy handling with moderate tackiness Variable Resistance to Chemicals and Hydrostatic Pressure

 

Applications Applications
fill gaps between low power low power applications requiring heat transfer across any large air gap
​heat-generating components and related heat sinks
boards or chassis that require complex, die cut shapes

Ease of Use 

  • No equipment, heating, or curing required. Pre-cured stamped parts supplied on a roll with release liner.

Broad Functionality

  • Effective as thermal interface/heat-transfer media, dielectric barriers, and stress-relieving shock/vibration absorbers

Flexibility 

  • High performance and durability over a wide range of temperature and humidity. 
  • Low durometer gel offers excellent compressibility which allows varying component height with low clamping force. 
  • Numerous thickness options to fill a large or small gap, while helping to minimize system costs
Features
  • Soft/compressible yet resilient and low compression set
  • Fully cured for improved thermal cycling without pump-out concerns
  • Provides low stress on the component
  • Perfect for non-parallel or rough surfaces
  • Consistency with manual application and minimal experience
  • TIM pads are easy to remove cleanly without solvent
Applications

Applications:

  • Consumer Products
  • Computers, laptops, servers, routers, switches
  • LEDs & lighting
  • Telecommunications
  • Automotive electronics
  • Electrical Inversion
  • Vibration dampening
  • Power PCB’s
Thin vs Gap Filler Pads
Thin Thermal Gap Pads Gap Filler Thermal Pads
Fiberglass reinforced, cost-competitive and thermally conductive soft gel pads  UV Stability
​Flame retardant and electrically insulating UV Resistant Silicone Topping Required
Provides shock absorption and easy handling with moderate tackiness Variable Resistance to Chemicals and Hydrostatic Pressure

 

Applications Applications
fill gaps between low power low power applications requiring heat transfer across any large air gap
​heat-generating components and related heat sinks
boards or chassis that require complex, die cut shapes
Benefits of Thermal Pads

Ease of Use 

  • No equipment, heating, or curing required. Pre-cured stamped parts supplied on a roll with release liner.

Broad Functionality

  • Effective as thermal interface/heat-transfer media, dielectric barriers, and stress-relieving shock/vibration absorbers

Flexibility 

  • High performance and durability over a wide range of temperature and humidity. 
  • Low durometer gel offers excellent compressibility which allows varying component height with low clamping force. 
  • Numerous thickness options to fill a large or small gap, while helping to minimize system costs

Quick Links

Resin Designs & Brand Product

Tacky

Hardness Shore 00

Specific Gravity

Thermal Conductivity W/mK min

Tear strength, 0.5 mm thickness, lbs/in

Weight loss % after 336 hrs at 150ºC

Volume Resistivity, ohm-cm

UL94 File No QMFZ2.E177248

 

Thin Thermal Gap Pads

Min Thickness (mm)UL 94

TP-1502

2 Side40-701.91.13601 max10EXP 12 min0.25-2.0V0

TP-1562

1 Side41-701.91.13901 max10EXP 12 min0.25-1.0V0

TP-1500

2 Side53 max2.081.34401 max3.2EXP 14 min0.24HB

TP-1560

1 Side53 max2.081.33601 max3.2EXP 14 min

TP-2200HP

2 Side70 max2.51.61301 max10EXP 13 min0.25-1.0
1.5-2.0
V1
V0

TP-2260HP 

1 Side63 max2.51.643701 max10EXP 12 min0.25-2.0V0

TP-3500

2 Side62 max3.43.52201 max1.4EXP 15 min0.25-3.0V0

TP-3560

1 Side62 max3.33.54701 max4.1EXP 14 min0.25-2.0V1

Gap Filler Thermal Pads

TP-2101

2 Side29 max1.90.73-1 max5EXP 13 min1.4-4.0V1
4.6V0

TP-2160

1 Side34 max1.80.73-1 max1.4EXP 13 min2.2-5.0HB

TP-2300

1 Side56 max2.51.4-1 max1.6EXP 11 min2.5HB
3.0-3.8V1
4.0-5.0V0
*The information contained here is provided for product selection purposes only and is not intended to be considered specification or performance data. Under no circumstances will the seller be liable for any loss, damage, expense, or incidental or consequential damage of any kind arising in connection with the use or inability to use its product. Specific conditions of sale and Chase’s limited warranty are set out in detail in Chase corporation terms and conditions of sale. Those terms and conditions are the only sources that contain Chase’s limited warranty and other terms and conditions.

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Thermal Gap Pads

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