Thermal gels and encapsulants offer the most flexibility in formulating to a flowable or non-flow product that fully cures to soft gel or firm elastomer for long term stability in thermal cycling. The cure rate can also be adjusted for rapid room temp cure or with long working time followed by heat curing. ThermoSink can be used as a TIM between component and heat sink, or assemblies can be encapsulated for optimum thermal management. Most are offered in a two-component 1:1 mix ratio package for automated meter-mix and dispensing.
Thermally Conductive Silicones
ThermoSink 35-3 is a two-component, low viscosity, thermally conductive silicone elastomer that cures rapidly at room temperature.
It is designed for electrical potting and/or thermal interface applications where high-performance heat transfer and thermal management is required.
ThermoSink Physical Properties Chart
|Mixed Visc||Pot Life||Cure Time||Specific Gravity||Mix Ratio||Thermal|
|ThermoSink 35-3||15,000 CPS||20 Mins||4 Hrs (RT)|
15 Mins (125C)
|2.9-3.2||1 to 1||>3.4 W/m Deg K||55 Shore A||UL V-0|
|ThermoSink 35-4||40,000 CPS||10 Mins||15 to 35 Mins(RT)|
<5 Mins (125C)
|2.9-3.3||1 to 1||>3.4 W/m Deg K||55 Shore A||UL V-0|
|ThermoSink-35-5||15,000 CPS||20 Mins||4 Hrs (RT)|
15 Mins (125C)
|2.9-3.2||1 to 1||>3.4 W/m Deg K||30 Shore A||UL V-0|
|ThermoSink-35-6||45,000 CPS||20 Mins||30 to 60 min (25°C)|
2 hrs (25°C)
45 min (100°C)
|2.87||50:50||>3.5 W/m Deg K||65-75 Durometer Shore A||V0|
|Automotive||Thermally conductive||Engineered Plastic||25 Kg plastic pails|
|Electronic assembly||Water resistant||Metal|
|Power supplies||Fast set, RT cure||Ceramic|
ThermoSink 35 3 Thermal Encapsulants Preparation