TP- 3560 Thermal Gap Pad offers a good combination of high thermal conductivity and compressibility. This fiberglass-  rein forced soft gel pad provides reduced interfacial thermal resistance, along with shock absorption and ease of application. It is ideal for use to fill gaps between high-power, heat-generating components and related heat sinks, boards, or chassis.

Key Features

• Thermal conductivity: 3.50 W/ m•K•
• Reworkable
• Excellent for complex, die-cut shapes
• Stress relieving
• Electrically insulating

Typical Properties: 

Storage:

Because these are precured materials, there is no special storage condition or usage date required. The product should be stored in its original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.