Thermal Products

Thermal  Solutions

Why a visitor should consider this product. What makes it different and how it will solve common problems.

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Features & Benefits

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ThermoSink Products

Thermal gels and encapsulants offer the most flexibility in formulating to a flowable or non-flow product that fully cures to soft gel or firm elastomer for long term stability in thermal cycling.

  • The cure rate can also be adjusted for rapid room temp cure or with long working time followed by heat curing.
  • ThermoSink can be used as a TIM between component and heat sink, or assemblies can be encapsulated for optimum thermal management.
  • Most are offered in a two-component 1:1 mix ratio package for automated meter-mix and dispensing.

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Thermal Gap Pads

Resin Designs Thermal Gap Pads are made of soft silicone and thermal conductors.

  • They are used to help remove heat in computers, tablets, smartphones, displays, and many other electronic applications.
  • The pads can be cut to virtually any size or shape and are easily placed, requiring no additional time to cure. They are just as easily removed for rework.
  • Thermal Gap Pads are available in thicknesses from 0.25 mm to 5.3 mm (0.01″ – 0.21″).
  • Whether interfacing a small heat sink to a single chip or an entire module to a metal plate, our compressible Thermal Gap Pads are the ideal solution.
  • Pre-cured thermal pads are used in TIM applications with gaps of 0.25 to 5.0 mm between component and heat sink.
  • They are usually supplied in sheet form or in roll form as die-cut pieces and applied either manually or with automation.
  • Fully cured from the factory, thermal pads have less shelf life concerns and devices can be assembled and packaged immediately.
  • Most pre-cured pads are soft and gel-like to minimize compression forces on the electronics and available in a broad range of both thicknesses and thermal conductivity.

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Thermally Conductive Epoxies

Thermal gels and encapsulants offer the most flexibility in formulating to a flowable or non-flow product that fully cures to soft gel or firm elastomer for long term stability in thermal cycling.

  • The cure rate can also be adjusted for rapid room temp cure or with long working time followed by heat curing.
  • ThermoSink can be used as a TIM between component and heat sink, or assemblies can be encapsulated for optimum thermal management.
  • Most are offered in a two-component 1:1 mix ratio package for automated meter-mix and dispensing.

Learn more

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