Resin Designs TP-2160 Thermal Gap Pad is a cost-competitive, highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap.

Key Features

• Thermal conductivity: 0.73 W/ m•K•
• Both Sides Compressible
• Foam reinforced
• Alumina-Filled System

Applications

• Switching devices
• Automatic power boards
• Microinverters

Typical Properties: 

Storage:

Because these are precured materials, there is no special storage condition or usage date required. The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.