Resin Designs TP-2300 Thermal Gap Pad is a cost-competitive, highly compressible, silicone gel pad. pad. This filled gel pad delivers better-than-average bulk thermal properties and industry-leading thermal resistance in moderate-to-high heat flux applications. It is ideal for use to fill gaps between heat-generating components and related heat sinks, boards or chassis.

Key Features

• Thermal conductivity: 1.4 W/ m•K•
• Excelent handling and ease of assembly
• High Compressibility
• Foam reinforced
• Flame retardant

 Applications

• Switching devices, robotic automation power boards, and high kilowatt solar microinverters

Typical Properties: 

Storage:

Because these are precured materials, there is no special storage condition or usage date required. The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.