Epoxy Encapsulation Solution 2E27-B

Epoxy Encapsulation Solution 2E27

HumiSeal® 2E27 encapsulant is:

  • Epoxy-based
  • 2 components
  • Medium viscosity
  • REACH and RoHS compliant

HumiSeal® 2E27 encapsulant has:

  • No VOCs or solvent
  • Excellent adhesion to a variety of substrates
  • Fast-curing, short-handling time
  • Simple 1:1 ratio

Application of HumiSeal® 2E27 encapsulant

Cleanliness of the substrate is of extreme importance for the successful application of HumiSeal 2E27. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Encapsulants can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials.  Users should perform adequate testing to confirm compatibility between the encapsulants and their particular assembly materials, process conditions and cleanliness level.

HumiSeal® 2E27 is a room temperature curing, two-part epoxy system designed to be used to encapsulate small electronic packages. This one to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) 5,000
Viscosity Part B (CPs) 6,000
Mix Ratio 1:1
Pot Life (min)* 15
Handling Time (min)* 60
Full Cure** 24 hr @ RT or 30 min @ 65oC
Cure Type 2 component with heat option
Color Clear
Hardness D60
Operating Temp (°C) -60 to 135 C
Applications Electronic and industrial sealing and encapsulation
Substrates Metals, Wood, Glass, Ceramics, Plastic

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